- Title
- Phase decomposition of AlCrFeCoNiCu0.5 HEA thin films by vacuum annealing
- Creator
- Zheng, Zhong; Zhao, Hong; Sun, Lixian; Liu, Yanping; Fu, Li; Bilek, Marcela M.; Akhavan, Behnam; Liu, Zongwen
- Relation
- Surfaces and Interfaces Vol. 43 Part A, Issue December 2023, no. 103541
- Publisher Link
- http://dx.doi.org/10.1016/j.surfin.2023.103541
- Publisher
- Elsevier
- Resource Type
- journal article
- Date
- 2023
- Description
- The most attractive advantages of high entropy alloy (HEA) thin films are their excellent properties, such as high strength and high corrosion and oxidation resistance, with a lower material cost. However, the thermal stability of the HEA thin films is always controversial. This is critical since the thermal stability of metals and alloys is closely related to the material’s performance at high temperatures and also determines the application field of the material. The question of how will the nanocrystalline high entropy alloy thin film perform in terms of thermal stability needs to be clarified urgently. In this research, the thermal stability of AlCrFeCoNiCu0.5 HEA thin film fabricated by cathodic arc deposition was investigated at 500 ◦ C as a function of time during vacuum annealing. X-Ray Diffraction (XRD), High-Resolution Transmission Electron Microscopy (HRTEM) and Transmission Kikuchi Diffraction (TKD) were applied to analyze the chemistry and microstructure of HEA thin films in detail. The results showed that there was no obvious change in the elemental compositions of the films after annealing, but the elemental distribution of the annealed films was different from the as-deposited film, especially at the film surface and film-substrate interface for the 24 h-annealed sample. The existence of the FeCo phase with B2 structure was a significant sign to demonstrate that the spinodal decomposition occurred in the single face-centered-cubic (FCC) phase matrix of the film during annealing. Simultaneously, the segregation of Cu and Cr near the film-substrate interface and the penetration of Ni and Cu towards the Si substrate were clearly observed. These unusual phenomena indicated that the thermal stability of HEA was not always excellent. Also, it was noticed that a few Kirkendall voids forming at the film-substrate interface after 24 h of annealing would affect the adhesion of the film. Additionally, heat recovery and recrystallization were achieved by 500 ◦C annealing, which were confirmed by the decrease of lattice parameter and the increase of grain size in the 24 h- annealed thin film. Furthermore, the hardness and elastic modulus of the thin films before and after annealing were measured by nanoindentation. The results showed all the thin films exhibited excellent mechanical properties, and the optimal hardness and elastic modulus of 7.7 ± 0.3 GPa and 183.9 ± 4.4 GPa were obtained after 3 h-annealing.
- Subject
- HEA thin film; thermal stability; segregation; phase decomposition; transmission electron microscopy
- Identifier
- http://hdl.handle.net/1959.13/1500126
- Identifier
- uon:54860
- Identifier
- ISSN:2468-0230
- Rights
- x
- Language
- eng
- Reviewed
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